This note covers the following topics: Optical Communications,
Elemental Semiconductors, Metal semiconductor contacts, Electron Microscopy and
Analysis, Magnetic Storage Technology, Scanning Probe Microscopy.
This note covers the following topics: physical structure of devices,
device structure through fabrication sequence, basic processing steps used
in fabricating integrated devices, then the use of these process steps in
fabricating a diode, bipolar junction transistor or FET.