This lecture note covers the following topics: Electrical Quantities, Circuit
Elements, Kirchoff's Current Law, Kirchoff's Voltage Law, Node-Voltage
Analysis, Mesh-Current Analysis, Thevenin and Norton Equivalence,
Superposition, RC Circuit: response to step function, integrator,
differentiator, Non-ideality in op amps, Dioeds, Power supply using zener
diodes, MOSFET, Common drain, active loads, current mirrors, current sources,
a mos implementation of op-amps.
This note covers the following topics: Fundamental circuit
concepts and analysis techniques , First and second order circuits, impulse and
frequency response, Op Amps, Diode and FET: Device and Circuits, Amplification,
Logic, Filter.
This note covers the following topics:
Semiconductor and Solid State Physics, Crystal Structure and Growth, Defects in
Semiconductors and Internal Gettering, Silicon Dioxide and Thermal Oxidation,
Current-Voltage Analysis, Thickness Measurement, Ultra Thin Oxides, Impurity
Diffusion, Sheet Resistance and Diffusion Profiles, Electrical Characteristics
of pn-Junctions, Atomic Processes of Diffusion, Ion Implantation, Implanted and
Diffused Profiles.
This note covers the
following topics: Basic Physics of Semiconductors, Diode Circuits, Physics of
Bipolar Transistors, Bipolar Amplifiers, Physics of MOS Transistors, CMOS
Amplifiers, Operational Amplifier as a Blac Box.
The target
audience of this note is undergraduate chemical engineering and electronics and
communication engineering students. The focus will be on the various modules
relevant for chip manufacturing. Topics covered includes: Lithography, Depostion
Techniques, Removal Techniques, FEOL, Diffusion, Ion Implantation, Oxidation, ,
process Integration, Testing, Yield, Tools and Techniques.
This lecture
note provides an introduction to the theoretical background and
application of each major IC fabrication processes: eg. oxidation, doping,
depositions, photolithography and etching. The prerequisites are the students
need are an understanding of basic transistor and diode operation. Topics
covered includes: Clean Room Technology Silicon Wafer Production,
Thermal Oxidation, Lithography, Advanced Lithography, Etching , Diffusion
Processes and Ion Implantation, Thin Film Deposition, Packaging, Yields,
Processing Silicon Foundries, CMOS and Bipolar Process Integration in practice,
Photolithography: resists, coating and mask aligners, CVD epitaxy and Plasma
etching.
This book focuses on the latest development of devices and fabrication
processes in the field of extremely miniaturized electromechanical systems. The
book offers new knowledge and insight into design, fabrication, and packaging,
as well as solutions in these aspects for targeted applications, aiming to
support scientists, engineers and academic trainees who are engaged in relevant
research.